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Titre: Out‐of‐plane ionicity versus in‐plane covalency interplay in high‐Tc cuprates
Auteur(s): Guerfi, T.
Mots-clés: Broken symmetry
High-Tc superconducting cuprates
Insulator-metal phase transition
Date de publication: 2017
Editeur: International Union of Crystallography
Collection/Numéro: Acta Crystallographica Section B: Structural Science, Crystal Engineering and MaterialsVolume 73, Issue 6, December 2017;pp. 1164-1171
Résumé: It may be argued that the remarkable properties of the high-temperature superconducting cuprates such as the insulator-metal transition (IMT) and the metal-superconductor transition (MST) originate from competition and interplay between the interlayer ionic interaction and the intralayer covalent bonds in these materials. It is proposed here that the microscopic order parameter is the local field estimated from the ionic polarization at the sub-unit cell level, and it is demonstrated that it shows a strong temperature as well as chemical doping dependence. The out-of-plane ionicity induces an interlayer electron transfer that reduces the ionicity of the layers and leads to IMT, while the in-plane covalency induces in-plane intersite hole transfer that increases the out-of-plane ionicity. It is suggested that this competition leads to a local field catastrophe at a critical temperature Tc that drives the compound to MST. The asymmetry of the free charge carrier density breaks locally the mirror reflection symmetry of the order parameter, leading to a pairing between the real current and the polarization current.The microscopic order parameter, which is responsible for the physics of high-Tc superconductors, especially the insulator-metal transition and the metal-superconductor transition, is the local field that reflects interlayer polarization. © International Union of Crystallography, 2017
URI/URL: Acta Crystallographica Section B: Structural Science, Crystal Engineering and MaterialsVolume 73, Issue 6, December 2017, Pages 1164-1171
10.1107/S205252061701575X
http://dlibrary.univ-boumerdes.dz:8080/handle/123456789/6716
ISSN: 2052-5206
Collection(s) :Publications Internationales
Publications Internationales

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